Three dimensional structure memory

DC CAFC

US 7,504,732 B2
Filed: 08/19/2002
Issued: 03/17/2009
Est. Priority Date: 04/04/1997
Status: Expired due to Term

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First Claim

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1. A stacked integrated circuit comprising:

a first thinned substantially flexible integrated circuit layer having a bottom-side surface;

a second thinned substantially flexible integrated circuit layer having a top-side surface, wherein the first integrated circuit layer overlies the second integrated circuit layer such that the bottom-side surface overlies at least part of the top-side surface, and wherein at least one of the first and second thinned substantially flexible integrated circuit layers comprises a low stress dielectric layer; and

an inter-layer stacked between the bottom-side surface of the first integrated circuit layer and the top-side surface of the second integrated circuit layer, wherein the inter-layer includes at least a first inter-layer portion and a second inter-layer portion that is electrically isolated from at least the first inter-layer portion, wherein each one of the first and second inter-layer portions forms a bond between the bottom-side surface of the first integrated circuit layer and the top-side surface of the second integrated circuit layer, and wherein only one of the first and second inter-layer portions forms at least one interconnection electrically coupling the first integrated circuit layer to the second integrated circuit layer for the transfer of information, wherein the at least one interconnection between the first and second integrated circuit layers is formed only on the bottom-side and top-side surfaces.

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Abstract

A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 μm in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density interlayer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.

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68 Claims

1. A stacked integrated circuit comprising:
- a first thinned substantially flexible integrated circuit layer having a bottom-side surface;
  
  a second thinned substantially flexible integrated circuit layer having a top-side surface, wherein the first integrated circuit layer overlies the second integrated circuit layer such that the bottom-side surface overlies at least part of the top-side surface, and wherein at least one of the first and second thinned substantially flexible integrated circuit layers comprises a low stress dielectric layer; and
  
  an inter-layer stacked between the bottom-side surface of the first integrated circuit layer and the top-side surface of the second integrated circuit layer, wherein the inter-layer includes at least a first inter-layer portion and a second inter-layer portion that is electrically isolated from at least the first inter-layer portion, wherein each one of the first and second inter-layer portions forms a bond between the bottom-side surface of the first integrated circuit layer and the top-side surface of the second integrated circuit layer, and wherein only one of the first and second inter-layer portions forms at least one interconnection electrically coupling the first integrated circuit layer to the second integrated circuit layer for the transfer of information, wherein the at least one interconnection between the first and second integrated circuit layers is formed only on the bottom-side and top-side surfaces.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
- - 2. The apparatus of claim 1, wherein at least one of the first integrated circuit layer and the second integrated circuit layer has a thickness of 50 microns or less.
  - 3. The apparatus of claim 1, wherein the at least one interconnection electrically coupling the first integrated circuit layer and second integrated circuit layer is a vertical interconnection.
  - 4. The apparatus of claim 1, wherein the first integrated circuit layer and the second integrated circuit layer comprise a single crystal semiconductor material or a polycrystalline semiconductor material.
  - 5. The apparatus of claim 1, wherein the first integrated circuit layer and the second integrated circuit layer comprise a logic integrated circuit or a memory integrated circuit.
  - 6. The apparatus of claim 5, wherein the logic integrated circuit is a microprocessor integrated circuit.
  - 7. The apparatus of claim 1, wherein the at least one interconnection connects circuitry on the first integrated circuit layer with circuitry on the second integrated circuit layer.
  - 8. The apparatus of claim 1, wherein the first integrated circuit layer and the second integrated circuit layer comprise logic integrated circuits.
  - 9. The apparatus of claim 1, further comprising:
    - a third thinned substantially flexible substrate having circuitry thereon, wherein the second thinned substantially flexible substrate overlies the third thinned substantially flexible substrate; and
      
      a second plurality of interconnections electrically coupling the circuitry on the third thinned substantially flexible substrate with the circuitry on the second substantially flexible substrate.
  - 10. The apparatus of claim 1, wherein the low stress dielectric layer is at least one of a silicon dioxide dielectric, an oxide of silicon dielectric and caused to have stress of about 5×
    - 10⁸dynes/cm²or less.
  - 11. The apparatus of claim 1, wherein at least one of the first and second integrated circuit layers comprises a substrate formed of a single crystal semiconductor.
  - 12. The apparatus of claim 1, wherein at least one of the following is true:
    - (i) the first and second integrated circuit layers are bonded together by at least one thermal diffusion bond, and (ii) the first and second integrated circuit layers are bonded together by at least one metal thermal diffusion bond that is not an electrical coupling.
  - 13. The integrated circuit of claim 1, wherein the at least one of the first and second thinned substantially flexible integrated circuit layers that comprises a low stress dielectric layer further comprises an oxide layer adjacent to the low stress dielectric layer.
  - 14. The integrated circuit of claim 13, wherein the at least one of the first and second thinned substantially flexible integrated circuit layers that comprises a low stress dielectric layer further comprises a passivation layer and a substrate layer, wherein the passivation layer is adjacent to the low stress dielectric layer and nonadjacent to the substrate layer.
  - 15. The integrated circuit of claim 1, wherein the inter-layer comprises at least one patterned metal layer.
  - 16. The integrated circuit of claim 15, wherein the at least one patterned metal layer includes at least one isolation void between the first inter-layer portion and the second inter-layer portion.

17. A stacked integrated circuit comprising:
- a first thinned substantially flexible substrate having circuitry and a bottom-side surface;
  
  a second thinned substantially flexible substrate having circuitry and a top-side surface, wherein the first thinned substantially flexible substrate overlies the second thinned substantially flexible substrate, such that the bottom-side surface overlies at least part of said top-side surface; and
  
  an inter-layer stacked between the bottom-side surface of the first thinned substantially flexible substrate and the top-side surface of the second thinned substantially flexible substrate, wherein the inter-layer includes at least a first inter-layer portion and a second inter-layer portion that is electrically isolated from at least the first inter-layer portion, wherein each one of the first and second inter-layer portions forms a bond between the bottom-side surface of the first thinned substantially flexible substrate and the top-side surface of the second thinned substantially flexible substrate, and wherein only one of the first and second inter-layer portions forms at least one interconnection electrically coupling the circuitry on the first substantially flexible substrate and the circuitry on the second substantially flexible substrate.
- View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
- - 18. The apparatus of claim 17, wherein the first thinned substantially flexible substrate has a thickness of 50 microns or less.
  - 19. The apparatus of claim 17, wherein the second thinned substantially flexible substrate has a thickness of 50 microns or less.
  - 20. The apparatus of claim 17, wherein the at least one interconnection is a vertical interconnection.
  - 21. The apparatus of claim 17, wherein the first and second thinned substantially flexible substrates comprise a single crystal semiconductor material or one of a polycrystalline semiconductor material.
  - 22. The apparatus of claim 17, wherein the circuitry of one of the first and second thinned substantially flexible substrates comprise logic circuitry or memory circuitry.
  - 23. The apparatus of claim 22, wherein the logic circuitry is a microprocessor integrated circuit.
  - 24. The apparatus of claim 17, wherein the first substrate is a non-semiconductor material.
  - 25. The apparatus of claim 17, wherein the circuitry of the first and second thinned substantially flexible substrates comprises logic circuitry.
  - 26. The apparatus of claim 17, further comprising:
    - a third thinned substantially flexible substrate having circuitry thereon, wherein the second thinned substantially flexible substrate overlies the third thinned substantially flexible substrate; and
      
      a second plurality of interconnections electrically coupling the circuitry on the third thinned substantially flexible substrate with the circuitry on the first substantially flexible substrate.
  - 27. The apparatus of claim 17, wherein at least one of the first and second substrates is formed of a single crystal semiconductor.
  - 28. The apparatus of claim 17, wherein at least one of the following is true:
    - (i) the first and second substrates are bonded together by at least one thermal diffusion bond, and (ii) the first and second substrates are bonded together by at least one thermal diffusion bond that is not an electrical coupling.
  - 29. The integrated circuit of claim 17, wherein at least one of the first and second thinned substantially flexible substrates comprises a low stress dielectric layer.
  - 30. The integrated circuit of claim 17, wherein the at least one interconnection is formed only on the bottom-side surface of the first thinned substantially flexible substrate and the top-side surface of the second thinned substantially flexible substrate.
  - 31. The apparatus of claim 29, wherein the low stress dielectric layer is at least one of a silicon dioxide dielectric, an oxide of silicon dielectric and caused to have stress of about 5×
    - 10⁸dynes/cm²or less.
  - 32. The integrated circuit of claim 29, wherein the at least one of the first and second thinned substantially flexible substrates that comprises a low stress dielectric layer further comprises an oxide layer adjacent to the low stress dielectric layer.
  - 33. The integrated circuit of claim 32, wherein the at least one of the first and second thinned substantially flexible substrates that comprises a low stress dielectric layer further comprises a passivation layer and a substrate layer, wherein the passivation layer is adjacent to the low stress dielectric layer and nonadjacent to the substrate layer.
  - 34. The integrated circuit of claim 17, wherein the inter-layer comprises at least one patterned metal layer.
  - 35. The integrated circuit of claim 34, wherein the at least one patterned metal layer includes at least one isolation void between the first inter-layer portion and the second inter-layer portion.

36. A stacked integrated circuit, comprising:
- a first thinned substantially flexible substrate having circuitry and a first facing surface;
  
  a second thinned substantially flexible substrate having circuitry and a second facing surface, wherein the first thinned substantially flexible substrate overlies the second thinned substantially flexible substrate, such that a region of the first facing surface overlies and faces the second facing surface; and
  
  an inter-layer between the region of the first facing surface and the second facing surface, wherein the inter-layer includes at least a first inter-layer portion and a second inter-layer portion, wherein each one of the first and second inter-layer portions forms a bond between the region of the first facing surface and the second facing surface, and wherein only one of the first and second inter-layer portions forms at least one conductive path between the circuitry of the first thinned substantially flexible substrate and the circuitry of the second thinned substantially flexible substrate.
- View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52)
- - 37. The apparatus of claim 36, wherein the first thinned substantially flexible substrate has a thickness of 50 microns or less.
  - 38. The apparatus of claim 36, wherein the second thinned substantially flexible substrate has a thickness of 50 microns or less.
  - 39. The apparatus of claim 36, wherein the first and second thinned substantially flexible substrates comprise a single crystal semiconductor material or a polycrystalline semiconductor material.
  - 40. The apparatus of claim 36, wherein the circuitry of one of the first and second thinned substantially flexible substrates is logic circuitry or memory circuitry.
  - 41. The apparatus of claim 40, wherein the logic circuitry is a microprocessor integrated circuit.
  - 42. The apparatus of claim 36, wherein the first substrate is a non-semiconductor material.
  - 43. The apparatus of claim 36, wherein the circuitry of the first and second thinned substantially flexible substrates is of logic circuitry.
  - 44. The apparatus of claim 36, wherein at least one of the first and second substrates is formed of a single crystal semiconductor.
  - 45. The apparatus of claim 36, wherein at least one of the following is true:
    - (i) the first and second substrates are bonded together by at least one thermal diffusion bond, and (ii) the first and second substrates are bonded together by at least one thermal diffusion bond that is not an electrical coupling.
  - 46. The integrated circuit of claim 36, wherein at least one of the first and second thinned substantially flexible substrates comprises a low stress dielectric layer.
  - 47. The apparatus of claim 46, wherein the low stress dielectric layer is at least one of a silicon dioxide dielectric, an oxide of silicon dielectric and caused to have stress of about 5×
    - 10⁸dynes/cm²or less.
  - 48. The integrated circuit of claim 46, wherein the at least one of the first and second thinned substantially flexible substrates that comprises a low stress dielectric layer further comprises an oxide layer adjacent to the low stress dielectric layer.
  - 49. The integrated circuit of claim 48, wherein the at least one of the first and second thinned substantially flexible substrates that comprises a low stress dielectric layer further comprises a passivation layer and a substrate layer, wherein the passivation layer is adjacent to the low stress dielectric layer and nonadjacent to the substrate layer.
  - 50. The integrated circuit of claim 36, wherein the inter-layer comprises at least one patterned metal layer.
  - 51. The integrated circuit of claim 36, wherein the second inter-layer portion is electrically isolated from at least the first inter-layer portion.
  - 52. The integrated circuit of claim 50, wherein the at least one patterned metal layer includes at least one isolation void between the first inter-layer portion and the second inter-layer portion.

53. A stacked integrated circuit, comprising:
- a first substrate having circuitry formed thereon and a first facing surface;
  
  a second substrate having circuitry thereon and a second facing surface, wherein the second substrate overlies the first substrate, such that a region of the second facing surface overlies and faces a region of the first facing surface; and
  
  an inter-layer between the region of the first facing surface and the region of the second facing surface, wherein the inter-layer includes at least a first inter-layer portion and a second inter-layer portion, wherein each one of the first and second inter-layer portions forms a bond between the region of the first facing surface and the region of the second facing surface, and wherein only one of the first and second inter-layer portions forms at least one conductive path between the circuitry of the first substrate and the circuitry of the second substrate.
- View Dependent Claims (54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68)
- - 54. The apparatus of claim 53, wherein the second substrate has a thickness of 50 microns or less.
  - 55. The apparatus of claim 53, wherein the first substrate and second substrate comprise a single crystal semiconductor material or a polycrystalline semiconductor material.
  - 56. The apparatus of claim 53, wherein the circuitry of one of the first substrate and second substrate is logic circuitry or memory circuitry.
  - 57. The apparatus of claim 56, wherein the logic circuitry is a microprocessor integrated circuit.
  - 58. The apparatus of claim 53, wherein the circuitry of the first substrate and second substrate is of logic circuitry.
  - 59. The apparatus of claim 58, wherein the logic circuitry is a microprocessor integrated circuit.
  - 60. The apparatus of claim 53, wherein at least one of the first and second substrates is formed of a single crystal semiconductor.
  - 61. The apparatus of claim 53, wherein at least one of the following is true:
    - (i) the first and second substrates are bonded together by at least one thermal diffusion bond, and (ii) the first and second substrates are bonded together by at least one thermal diffusion bond that is not an electrical coupling.
  - 62. The integrated circuit of claim 53, wherein at least one of the first and second substrates comprises a low stress dielectric layer.
  - 63. The apparatus of claim 62, wherein the low stress dielectric layer is at least one of a silicon dioxide dielectric, an oxide of silicon dielectric and caused to have stress of about 5×
    - 10⁸dynes/cm²or less.
  - 64. The integrated circuit of claim 62, wherein the at least one of the first and second substrates that comprises a low stress dielectric layer further comprises an oxide layer adjacent to the low stress dielectric layer.
  - 65. The integrated circuit of claim 64, wherein the at least one of the first and second substrates that comprises a low stress dielectric layer further comprises a passivation layer and a substrate layer, wherein the passivation layer is adjacent to the low stress dielectric layer and nonadjacent to the substrate layer.
  - 66. The integrated circuit of claim 53, wherein the inter-layer comprises at least one patterned metal layer.
  - 67. The integrated circuit of claim 53, wherein the second inter-layer portion is electrically isolated from at least the first inter-layer portion.
  - 68. The integrated circuit of claim 66, wherein the at least one patterned metal layer includes at least one isolation void between the first inter-layer portion and the second inter-layer portion.

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Litigation Data

Current Assignee
Elm 3DS Innovations LLC
Original Assignee
ELM TECHNOLOGY CORPORATION
Inventors
Leedy, Glenn J.
Primary Examiner(s)
CHIU, TSZ K

Application Number

US10/222,816
Publication Number

US 20030057564A1
Time in Patent Office

2,402 Days
Field of Search

None
US Class Current

257/777
CPC Class Codes

G11C 5/02   Disposition of storage elem...

G11C 5/06   Arrangements for interconne...

H01L 21/76898   formed through a semiconduc...

H01L 2224/8083   Solid-solid interdiffusion

H01L 2224/8384   Sintering

H01L 23/481   Internal lead connections, ...

H01L 23/5226   Via connections in a multil...

H01L 25/0657   Stacked arrangements of dev...

H01L 27/0688   Integrated circuits having ...

H01L 29/02   Semiconductor bodies ; Mult...

H01L 2924/01079   Gold [Au]

H10B 12/50   Peripheral circuit region s...

Y10S 438/977   Thinning or removal of subs...

Three dimensional structure memory

First Claim

4 Assignments

Litigations

1 Petition

Accused Products

Abstract

308 Citations

68 Claims

Specification

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Three dimensional structure memory

First Claim

4 Assignments

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Litigations

1 Petition

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Accused Products

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Abstract

308 Citations

68 Claims

Specification

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Solutions

Use Cases

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