Three dimensional structure memory
First Claim
1. An integrated circuit structure comprising:
- a first substrate of semiconductor material with at least one of interconnections supported thereby and integrated circuitry formed thereon; and
a second substrate of semiconductor material made from a semiconductor wafer, wherein the second substrate is of one piece and is a thinned substantially flexible substrate with circuitry comprising a plurality of integrated circuit devices formed thereon, the plurality of integrated circuit devices defining an integrated circuit die having an area, a layer formed over the second substrate being bonded to a layer formed over the first substrate with conductive paths therebetween;
wherein the second substrate extends throughout at least a substantial portion of the area of the integrated circuit die.
4 Assignments
0 Petitions
Accused Products
Abstract
A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 μm in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.
384 Citations
24 Claims
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1. An integrated circuit structure comprising:
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a first substrate of semiconductor material with at least one of interconnections supported thereby and integrated circuitry formed thereon; and a second substrate of semiconductor material made from a semiconductor wafer, wherein the second substrate is of one piece and is a thinned substantially flexible substrate with circuitry comprising a plurality of integrated circuit devices formed thereon, the plurality of integrated circuit devices defining an integrated circuit die having an area, a layer formed over the second substrate being bonded to a layer formed over the first substrate with conductive paths therebetween; wherein the second substrate extends throughout at least a substantial portion of the area of the integrated circuit die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification