Finishing method for semiconductor wafers using a lubricating boundary layer
First Claim
Patent Images
1. A method of finishing of a semiconductor wafer surface being finished having uniform regions and a plurality of wafer die, each wafer die having a repeating pattern of unwanted raised regions, the method comprising the steps of:
- providing a finishing element finishing surface;
supplying an organic boundary lubricant to the interface between the semiconductor wafer surface being finished and the finishing element finishing surface;
positioning the semiconductor wafer surface being finished proximate to the finishing surface;
applying an operative finishing motion in the interface between the semiconductor wafer surface being finished and the finishing element finishing surface; and
wherein applying the operative finishing motion to the operative finishing interface forms an organic lubricating boundary layer of from 1 to 6 molecules thick which interacts with and adheres to the semiconductor wafer surface for at least a portion of the finishing cycle time.
3 Assignments
0 Petitions
Accused Products
Abstract
A method of using lubricating boundary layers for finishing semiconductor wafers is described. The lubricating boundary layer thickness is controlled to improve finishing and reduce unwanted surface defects. Differential lubricating boundary layer methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing.
64 Citations
26 Claims
-
1. A method of finishing of a semiconductor wafer surface being finished having uniform regions and a plurality of wafer die, each wafer die having a repeating pattern of unwanted raised regions, the method comprising the steps of:
-
providing a finishing element finishing surface;
supplying an organic boundary lubricant to the interface between the semiconductor wafer surface being finished and the finishing element finishing surface;
positioning the semiconductor wafer surface being finished proximate to the finishing surface;
applying an operative finishing motion in the interface between the semiconductor wafer surface being finished and the finishing element finishing surface; and
wherein applying the operative finishing motion to the operative finishing interface forms an organic lubricating boundary layer of from 1 to 6 molecules thick which interacts with and adheres to the semiconductor wafer surface for at least a portion of the finishing cycle time. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. A method of finishing of a semiconductor wafer surface being finished having uniform regions having a plurality of unwanted raised regions, the method comprising the steps of:
-
providing a finishing element finishing surface;
supplying an organic boundary lubricant to the interface between the semiconductor wafer surface being finished and the finishing element finishing surface;
positioning the semiconductor wafer surface being finished proximate to the finishing surface;
applying an operative finishing motion in the interface between the semiconductor wafer surface being finished; and
whereinapplying the operative finishing motion to the operative finishing interface forms an organic lubricating boundary layer having a thickness of at most 4 molecules on at least a portion of the semiconductor surface being finished and;
the operative finishing motion forms a friction in the interface between a uniform region of the semiconductor wafer surface and the finishing element finishing surface;
the organic boundary layer physically or chemically interacts with and adheres to a uniform region of the semiconductor wafer surface;
the friction formed between the uniform region of the semiconductor wafer surface and the finishing element finishing surface is determined by properties other than viscosity. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
-
-
21. A method of finishing of a semiconductor wafer surface being finished comprising the steps of:
-
providing a finishing element finishing surface;
providing an organic lubricant to an operative finishing interface;
applying an operative finishing motion in the operative finishing interface forming an organic lubricating boundary layer of from 1 to 6 molecules thick; and
controlling at least once the thickness of the organic lubricating boundary layer which changes the coefficient of friction in the operative finishing interface by changing at least one process control parameter in situ based on feed back information from a control subsystem during the finishing cycle time. - View Dependent Claims (22, 23, 24, 25, 26)
-
Specification