Electronic package carrying an electronic component and assembly of mother board and electronic package
DC CAFC
First Claim
Patent Images
1. An electronic package comprising:
- a rigid planar dielectric substrate carrying a ground member extending across substantially the whole area within the confines of the edges of the substrate;
a covering EMI shield extending over the electronic component to locate the electronic component between the EMI shield and the around member of the substrate, the EMI shield being electrically interconnected to the ground member of the substrate to form with the ground member, a Faraday cage around the electronic component;
and a plurality of second level interconnects mounted upon a second side of the substrate and electrically interconnected through circuit paths in the substrate to the first level interconnects.
8 Assignments
Litigations
1 Petition
Accused Products
Abstract
Electronic package with an electronic component mounted upon a PCB or ceramic substrate by first level interconnects and housing second level interconnects on the other side of the PCB. The component is protected by an EMI shield which is grounded to a ground plane of the PCB. Especially significant when there are a plurality of components protected by the shield and when at least one of the components is an integrated circuit component (I.C.C.). The package is thus prebuilt with the EMI shield and without a separate package required for each I.C.C., and is robust in construction for shipping. The shield and ground plane provide a Faraday cage which is especially complete when the shield extends around edges of the PCB and onto its other side. The package is ready for connection to a motherboard by use of the second level interconnects and process steps to place EMI shields individually onto mother boards are avoided.
160 Citations
12 Claims
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1. An electronic package comprising:
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a rigid planar dielectric substrate carrying a ground member extending across substantially the whole area within the confines of the edges of the substrate; a covering EMI shield extending over the electronic component to locate the electronic component between the EMI shield and the around member of the substrate, the EMI shield being electrically interconnected to the ground member of the substrate to form with the ground member, a Faraday cage around the electronic component; and a plurality of second level interconnects mounted upon a second side of the substrate and electrically interconnected through circuit paths in the substrate to the first level interconnects. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An assembly of a mother board and an electronic package incorporating a rigid planar daughter board, the package further comprising:
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an electronic component mounted upon a first side of the daughter board and having terminals connected to a plurality of first level terminal interconnects provided upon the first side of the board; a covering EMI shield extending over the electronic component and being electrically interconnected to a ground member of the daughter board; and a plurality of second level interconnects mounted upon a second side of the daughter board and electrically interconnecting through the daughter board to the first level interconnects, the second level interconnects mounting the electronic package onto the mother board and electrically connecting the electronic component with circuitry in the mother board.
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10. A method of making an electronic package comprising:
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mounting an electronic component upon a rigid planar dielectric substrate with terminals of the component connected to first level terminal interconnects located on a first side of the substrate, the first level terminal interconnects being interconnected with second level interconnects located on a second side of the substrate; and forming a Faraday cage around the electronic component by locating an EMI shield upon the substrate so as to cover the electronic component, and electrically interconnecting the shield to a ground member of the substrate, the around member extending across substantially the while area within the confines of the edges of the substrate. - View Dependent Claims (11)
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12. A method of assembling an electronic package comprising a daughter board onto a mother board wherein the package further comprises an electronic component mounted upon a first side of and having terminals connected to a plurality of first level terminal interconnects located upon the first side of the daughter board;
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a covering EMI shield extending over the electronic component and being electrically interconnected to a ground member of the daughter board; and a plurality of second level interconnects mounted on a second side of the daughter board and electrically interconnecting through the daughter board to the first level interconnects; the method comprising disposing the package with the second level interconnects in desired locations with respect to electrical terminals on one surface of the mother board and electrically interconnecting the second level interconnects with the electrical terminals of the mother board.
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Specification
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Litigation Data
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Current AssigneeRPX Clearinghouse LLC (RPX Corporation)
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Original AssigneeNorthern Telecom Limited (Nortel Networks Corporation)
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InventorsChan, Yee-Ning
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Primary Examiner(s)Picard, Leo P.
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Assistant Examiner(s)Gandhi, Jayprakash N.
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Application NumberUS08/691,056Time in Patent Office838 DaysField of Search361/760, 361/767, 361/818, 174/35 R, 174/35 GC, 174/357 S, 174/51, 257/659, 257/660, 257/699, 257/723, 257/728, 257/738, 257/778, 437/221, 29/832, 29/840US Class Current361/818CPC Class CodesH01L 2224/16225 the item being non-metallic...H01L 2224/32225 the item being non-metallic...H01L 2224/73204 the bump connector being em...H01L 23/552 Protection against radiatio...H01L 2924/00 Indexing scheme for arrange...H01L 2924/15311 being a ball array, e.g. BGAH01L 2924/16152 Cap comprising a cavity for...H01L 2924/19105 in a side-by-side arrangeme...H01L 2924/3025 Electromagnetic shieldingY10S 174/34 PCB in box or housing
