Circuit substrate connecting structure, liquid crystal display device having the connecting structure and mounting method of liquid crystal display device
DC CAFC
First Claim
1. A connecting structure of a circuit boards, comprising:
- a circuit board connected to a substrate opposing thereto through an electrically conductive adhesive film;
a connecting region formed by removing a surface protective member in a vicinity of side portions of said circuit board;
a plurality of connecting terminal groups arranged in said connecting region at a predetermined interval, each connecting terminal group including a plurality of terminals formed by exposing portions of an internal wiring; and
a bonding assist portion arranged between adjacent ones of said terminal groups in said connecting region, said bonding assist portion including at least one protrusion that connects to a fixed potential line on said circuit board.
5 Assignments
Litigations
1 Petition
Accused Products
Abstract
In connecting a connecting substrate 4 to a flexible substrate 5 connected to a terminal portion of one of substrates constituting a liquid crystal display panel through an anisotropic conductive film (ACF) 20, a bonding assist member 17 formed of the same material as that of an internal wiring or a connecting terminal of the connecting substrate and having substantially the same height as that of the connecting terminal is provided between adjacent terminal groups each including a plurality of connecting terminals 4b in a terminal forming region of a non-coating portion 14 in the vicinity of the connecting substrate 4, to absorb a difference in height between the terminal groups and the non-coating portion by the bonding assist member 17 to thereby make the ACF in an intimate contact with the terminal groups as well as the exposed regions uniformly throughout thereof during a temporary press-bonding step of the ACF and prevent a peeling-off and/or breakage of the ACF between the terminal groups and improve the reliability of electrical connection.
9 Citations
10 Claims
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1. A connecting structure of a circuit boards, comprising:
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a circuit board connected to a substrate opposing thereto through an electrically conductive adhesive film;
a connecting region formed by removing a surface protective member in a vicinity of side portions of said circuit board;
a plurality of connecting terminal groups arranged in said connecting region at a predetermined interval, each connecting terminal group including a plurality of terminals formed by exposing portions of an internal wiring; and
a bonding assist portion arranged between adjacent ones of said terminal groups in said connecting region, said bonding assist portion including at least one protrusion that connects to a fixed potential line on said circuit board. - View Dependent Claims (2, 3)
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4. A connecting structure of a circuit board, comprising:
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a circuit board connected to a substrate opposing thereto through an electrically conductive adhesive film;
a connecting region formed by removing a surface protective member in a vicinity of side portions of said circuit board;
a plurality of connecting terminal groups arranged in said connecting region at a predetermined interval, each connecting terminal group including a plurality of terminals formed by exposing portions of an internal wiring; and
a bonding assist portion arranged between adjacent ones of said terminal groups in said connecting region, wherein said bonding assist portion has a predetermined wiring pattern portion and a protrusion provided in an edge portion of said wiring pattern portion and connected to a fixed potential line on the side of said circuit board. - View Dependent Claims (5, 6, 7, 8, 9, 10)
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Specification
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- Resources
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Current AssigneeHannStar Display Corporation
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Original AssigneeNEC LCD Technologies Limited (NEC Corporation)
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InventorsSatonaka, Masaharu
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Primary Examiner(s)Vu, Phuong T.
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Assistant Examiner(s)NORRIS, JEREMY C
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Application NumberUS10/259,543Publication NumberTime in Patent Office998 DaysField of Search361792-795, 361/803, 174/259, 174/260, 174/261, 298/30US Class Current174/259CPC Class CodesG02F 1/13452 Conductors connecting drive...H05K 1/117 Pads along the edge of rigi...H05K 1/142 Arrangements of planar prin...H05K 2201/09681 Mesh conductors, e.g. as a ...H05K 2201/09781 Dummy conductors, i.e. not ...H05K 3/323 by applying an anisotropic ...H05K 3/361 Assembling flexible printed...
